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Fabrication ware radio communication, broadcasting and television antennas

These misleading scams have been around for several years. The concept marginally works when the owner attaches it to a window, which gives it more signal to work with than an antenna placed in the corner of a room. In fact, it is a website that reviews products, but has a financial incentive to write glowing reviews to encourage you to buy whatever they write about. Goodsavingstips stretches the truth about the ClearView antenna more than a salt water taffy machine on the Atlantic City Boardwalk:. Millions of Americans are doing just that, thanks to a brand new rule in that allows certain regions access to free TV. Thankfully, if you live in an area where this new rule went into effect, you no longer need to give your hard earned money away to the big cable companies.

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Eagle-eyed cars

VIDEO ON THE TOPIC: Running a Channel Scan with a TV Antenna? Avoid This Common Mistake

The present invention relates to electronic packages, and more particularly, to an electronic package having an antenna structure. Along with the rapid development of electronic industries, electronic products are developed towards multi-function and high electrical performance.

Wireless communication technologies have been widely applied in various kinds of consumer electronic products for receiving or transmitting various wireless signals. To meet the miniaturization requirement of consumer electronic products, wireless communication modules are becoming lighter, thinner, shorter and smaller. For example, patch antennas have been widely applied in wireless communication modules of electronic products such as cell phones and personal digital assistants PDAs due to their advantages of small size, light weight and easy fabrication.

Referring to FIG. The substrate 10 is a circuit board and has a rectangular shape. The antenna structure 12 is of a planar type. The antenna structure 12 has a main body and a conductive wire , and the main body is electrically connected to the electronic elements 11 through the conductive wire The encapsulant 13 encapsulates the electronic elements 11 and a portion of the conductive wire However, based on the characteristic of electromagnetic radiation between the planar-type antenna structure 12 and the electronic elements 11 and limitation of the size of the planar-type antenna structure 12 , the encapsulant 13 only covers the electronic elements 11 and exposes the main body of the antenna structure Therefore, a mold that corresponds in size to the disposing area of the electronic elements 11 instead of the overall substrate 10 is needed in a molding process for forming the encapsulant Further, the planar-type antenna structure 12 occupies a large surface area of the substrate 10 and hinders miniaturization of the wireless communication module 1.

Therefore, there is a need to provide an electronic package and a fabrication method thereof so as to overcome the above-described drawbacks. In view of the above-described drawbacks, the present invention provides an electronic package, which comprises: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate and having an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the extension portion and the support portions of the antenna structure.

The present invention further provides a fabrication method of an electronic package, which comprises the steps of: providing a substrate having at least an electronic element disposed thereon; disposing an antenna structure on the substrate, wherein the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate; and forming an encapsulant on the substrate for encapsulating the electronic element and the extension portion and the support portions of the antenna structure.

In an embodiment, the extension portion is located at a position higher than that of the electronic element. In an embodiment, the support portions serve as input and ground terminals for electrically connecting the extension portion to the substrate.

According to the present invention, the extension portion of the antenna structure is supported over the substrate by the support portions of the antenna structure, and the extension portion and the support portions of the antenna structure and the electronic element are encapsulated by the encapsulant. Therefore, the invention allows a mold having a size corresponding to the substrate to be used in a molding process for forming the encapsulant, thereby facilitating the molding process.

Further, since the extension portion can be supported by the support portions over a region of the substrate where the electronic element is disposed i. Therefore, compared with the prior art, the invention can effectively reduce the size of the substrate so as to meet the miniaturization requirement of the electronic package.

The following illustrative embodiments are provided to illustrate the disclosure of the present invention, these and other advantages and effects can be apparent to those in the art after reading this specification. It should be noted that all the drawings are not intended to limit the present invention.

Various modifications and variations can be made without departing from the spirit of the present invention. In the present embodiment, the electronic package 2 is a SiP system in package wireless communication module. Then, an antenna structure 22 is disposed on and electrically connected to the substrate In the present embodiment, the substrate 20 is a circuit board or a ceramic board and has a rectangular shape, and a circuit is formed on the substrate Further, a circuit layer not shown can be formed inside the substrate The electronic elements 21 can be active or passive elements.

The electronic elements 21 are electrically connected to the circuit The antenna structure 22 is made of a metal frame.

The antenna structure 22 has an extension portion and a plurality of support portions vertically disposed on the substrate 20 for supporting the extension portion over the substrate As such, the extension portion is located at a position higher than that of the electronic elements Further, the extension portion extends along side edges of the substrate 20 so as to surround the electronic elements Furthermore, at least two support portions are provided to serve as an input terminal and a ground terminal of the circuit , and the extension portion serves as a main body of the antenna structure The extension portion can have an open shape, such as a C shape of FIG.

Alternatively, referring to FIG. In other embodiments, the extension portion can have a bent shape such as an L shape or a closed shape such as a circular shape. In the present invention, a metal sheet is formed into the 3D antenna structure 22 and then the extension portion of the antenna structure 22 is disposed over the substrate 20 and surrounds the electronic elements 21 so as to allow the extension portion and the electronic elements 21 to be encapsulated by the encapsulant 23 through a molding process.

Therefore, the invention allows a mold having a size corresponding to the substrate 20 to be used in the molding process so as to facilitate the fabrication process. Further, the encapsulant 23 can stably fix the antenna structure 22 to a certain height, and the dielectric constant of the encapsulant 23 can reduce the required electrical length of the antenna structure.

In addition, since the extension portion is supported by the support portions over the substrate 20 , the antenna structure 23 can be disposed in the same region where the electronic elements 21 are disposed i. As such, the invention avoids direct disposing of the extension portion on the substrate 20 so as to save the surface area of the substrate Compared with the prior art, the present invention can reduce the size of the substrate 20 so as to meet the miniaturization requirement of the electronic package 2.

Also, by disposing the extension portion over the substrate 20 , a receiving space is formed between the extension portion and the substrate 20 so as for other electrical structures to be disposed therein. The electronic elements 21 are active or passive elements and electrically connected to the circuit Therefore, the present invention provides a 3D antenna structure to replace the conventional planar type antenna structure.

The 3D antenna structure can be disposed on the substrate in a region where the electronic elements are disposed to thereby facilitate the fabrication process and reduce the size of the substrate so as to meet the miniaturization requirement of the electronic package.

The above-described descriptions of the detailed embodiments are only to illustrate the preferred implementation according to the present invention, and it is not to limit the scope of the present invention. Accordingly, all modifications and variations completed by those with ordinary skill in the art should fall within the scope of present invention defined by the appended claims. All rights reserved. A SumoBrain Solutions Company. Login Sign up.

Search Expert Search Quick Search. An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure.

Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.

Click for automatic bibliography generation. Silconware Precision Industries Co. Taichung, TW. What is claimed is: 1. An electronic package, comprising: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate and having an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the extension portion and the support portions of the antenna structure.

The package of claim 1, wherein the substrate has a circuit electrically connected to the electronic element. The package of claim 1, wherein the electronic element is an active element or a passive element. The package of claim 1, wherein the antenna structure is made of a metal frame.

The package of claim 1, wherein the extension portion serves as a main body of the antenna structure. The package of claim 1, wherein the extension portion has a bent shape, a circular shape or a C shape. The package of claim 1, wherein the extension portion is located at a position higher than that of the electronic element.

The package of claim 1, wherein the support portions serve as input and ground terminals for electrically connecting the extension portion to the substrate. The package of claim 1, wherein the extension portion surrounds the electronic element. A fabrication method of an electronic package, comprising the steps of: providing a substrate having at least an electronic element disposed thereon; disposing an antenna structure on the substrate, wherein the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate; and forming an encapsulant on the substrate for encapsulating the electronic element and the extension portion and the support portions of the antenna structure.

The method of claim 10, wherein the substrate has a circuit electrically connected to the electronic element. The method of claim 10, wherein the electronic element is an active element or a passive element.

The method of claim 10, wherein the antenna structure is made of a metal frame. The method of claim 10, wherein the extension portion serves as a main body of the antenna structure. The method of claim 10, wherein the extension portion has a bent shape, a circular shape or a C shape.

The method of claim 10, wherein the extension portion is located at a position higher than that of the electronic element. The method of claim 10, wherein the support portions serve as input and ground terminals for electrically connecting the extension portion to the substrate. The method of claim 10, wherein the extension portion surrounds the electronic element.

Field of the Invention The present invention relates to electronic packages, and more particularly, to an electronic package having an antenna structure. Description of Related Art Along with the rapid development of electronic industries, electronic products are developed towards multi-function and high electrical performance.

SUMMARY OF THE INVENTION In view of the above-described drawbacks, the present invention provides an electronic package, which comprises: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate and having an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the extension portion and the support portions of the antenna structure.

In an embodiment, the substrate has a circuit electrically connected to the electronic element. In an embodiment, the electronic element is an active element or a passive element. In an embodiment, the antenna structure is made of a metal frame. In an embodiment, the extension portion serves as a main body of the antenna structure.

In an embodiment, the extension portion has a bent shape, a circular shape or a C shape. In an embodiment, the extension portion surrounds the electronic element. The substrate 20 has a circuit Tri-band antenna. Planar broadband inverted F-type antenna and information terminal. High performance multimode horn for communications and tracking. Digital TV Antenna.

We, the several persons, whose names, addresses, and description and subscribed hereunder are desirous of being formed into a Company in pursuance to this Memorandum of Association and we respectively agree to take the number of shares in the Capital of the Company set opposite to our respective names. The registered office of the company will be situated in the National Capital Territory of Delhi.

In radio systems, many different antenna types are used with specialized properties for particular applications. Antennas can be classified in various ways. The list below groups together antennas under common operating principles, following the way antennas are classified in many engineering textbooks. The dipole, monopole, array and large loop antenna types below typically function as resonant antennas; waves of current and voltage bounce back and forth between the ends, creating standing waves along the elements.

Public Radio Resource Guide

Account Options Login. Koleksiku Bantuan Penelusuran Buku Lanjutan. Dapatkan buku cetak. Business Information Agency Amazon. Belanja Buku di Google Play Jelajahi eBookstore terbesar di dunia dan baca lewat web, tablet, ponsel, atau ereader mulai hari ini.

Archer Cb Antenna. It was adequate, but that. Showcasing Vintage Rabbit Ears in stock and ready for shipping right now. This link is listed in our web site directory since Thursday Dec 25 , and till today "Peanut's CB Radio Shop" has been followed for a total of times. Shop with confidence on eBay!. We also offer parts, service, and more!. Antennas that have an easy, often mechanical, tuning device are referred to as a "tunable antenna".

SEE VIDEO BY TOPIC: Lava HD-8008 Omnipro Omni Directional HD TV Antenna Review
Terrestrial television is a term which refers to modes of television broadcasting which do not involve satellite transmission or via underground cables.

About Andrew Andrew Corporation was an international supplier of communications equipment, systems, and services. Andrew had eight manufacturing plants in the US and additional factories in Canada, Australia, Scotland, Brazil, China, and India and 4, employees; nearly half of revenues stem from products exported from the US or manufactured abroad. Andrew sales in exceeded million USD. Two manufacturing facilities in the USA and Canada were remaining after restructuring the company in '97 and ' The company supported customers from 35 countries across Asia-Pacific, Europe, and the Americas with a worldwide Sales Support organization. Andrew Corporation history In , Victor J. During World War II, the company broadened its product line, manufacturing communications gear and cable for the military. After the war, Andrew made antennas, cables, and connectors. In Andrew moved its headquarters and some production to suburban Orland Park. By that time, Andrew had become an international corporation with about 2, employees in the Chicago area and over 4, worldwide.

Diy Outernet Antenna

Telemetrics offers a full portfolio of camera robotics and control systems used extensively by a wide variety of broadcast, production, sports, legislative, military, corporate, education and houses of worship installations seeking value, reliability and a fast return on investment. Media Excel defines the adaptive bitrate, multi-device transcoding standard for multi-screen video delivery. At Spectra Logic we define, design and deliver innovative data protection through tape and disk-based backup, recovery and archive storage solutions. By igniting innovation we challenge expectations of the data protection market with intelligent, integrated, and simple to use backup and archive technologies.

The independent group is among the technology and market leaders in all of its business fields, including wireless communications and RF test and measurement, broadcast and media, air traffic control and military radiocommunications, cybersecurity and network technology. The company owes this tremendous success to its 12, highly qualified employees in over 70 countries. Press Release Jan

Diy Outernet Antenna Thanks for. Radio for Everyone: Easy homemade Outernet antenna. This banner text can have markup. Find a tube with a circumference equal to one wavelength, and wrap wire in a helix spaced a quarter wavelength. Outernet provides a unique service, broadcasting digital media content at no charge. If you wish to run the Outernet software as a non-root user recommended , you should answer y to this question. Udev will be reconfigured so that the radio device is accessible to non-root users. Accessing The Outernet Tutorial This is an excellent guide from rtl-sdr.

Pace supplies its set-top boxes to a large number of digital TV broadcasters, Pacific Wireless designs and manufactures state of the art wireless communications They currently manufacture antennas for Base Station and CPE applications in the The SIPware Broadband Telephony service is a turnkey, software-based.

Antenna types

Winegard digital HDTV antennas provide the maximum content available in your area. Choose from a variety of TV antennas built specifically to maximize the number of TV channels received in your exact location. Submit Search. Home Products Hdtv Digital Antennas. Need Help? Indoor Antennas. Antennas have changed a bit since your grandfather attached one to the house. Once our signal finder app is used to find an antenna tower, a good position for the indoor antenna can be found for the best signal strength for optimal viewing.

Cut the Cord & Save - Free HDTV

Fast Scan Amateur television has been around in Ham Radio for over 70 years. Articles about Hams experimenting with motor driven scanning disks appeared in QST as early as Most modern Fast Scan Amateur Television, or ATV, uses a transmission format fully compatible with video equipment designed for the individual consumer market. The video is amplitude modulated; the audio is frequency modulated. This means that a Fast Scan ATV picture displays full motion, has a simultaneous sound channel, is usually in color, and has excellent detail just like commercial television. Fast Scan TV is sometimes transmitted using a frequency-modulated format for both the video and audio, which can also be received using readily available equipment. Amateur television offers a major advantage over broadcast TV though, in that we can communicate interactively or two ways.

Satellite Tracking Antenna System

Provide Feedback. Manufacturer of FM frequency modulation transmission equipment for radio and television applications. Products include transmitters, receivers, exciters, analog and digital modulators, MPEG encoders, mixing consoles, stereo generators, digital audio processors and Omni directional antennas. Manufacturing, Sales, Service, Training.

These HDTV antennas were invented by a NASA scientist, and they get you free network TV for life

Posted two months ago. Images with little detail can be produced from this. All doable with a tech license.

Television Transmitters Suppliers

The Public Radio Resource Guide highlights some of the resources available to the public radio community. It provides a comprehensive list of products and service providers for the public radio industry. American Public Media Producer and distributor of public radio programming.

The present invention relates to electronic packages, and more particularly, to an electronic package having an antenna structure. Along with the rapid development of electronic industries, electronic products are developed towards multi-function and high electrical performance.

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